Sync third-party and MCP marketplace plugins

Constraint: Public skills are published only by explicit administrator action unless they are tracked third-party market sources.
Confidence: high
Scope-risk: narrow
Directive: Keep private/internal skills out of the public marketplace and preserve normal incremental market Git history.
Tested: Marketplace validation passed.
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KeyInfo Bot committed 2026-09-15 14:50:04 +08:00
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@@ -806,6 +806,62 @@
"etunel-role-collaboration": "用于 Etunel 多 Agent 项目的角色识别、Hub 中介、依赖任务波次、正式成果、人类负责人确认、阶段交接和消息流程协作。"
}
},
{
"id": "hardware-development",
"repo": "https://git.playones.com/xufeng/hardware-development.git",
"releaseChannel": "latest-stable",
"releaseProvider": "gitea",
"adapter": "claude-skill",
"pluginName": "hardware-development",
"category": "Developer Tools",
"skillPath": ".",
"sparseCheckout": [
"SKILL.md",
"agents",
"references"
],
"brandColor": "#0F766E",
"manifestOverrides": {
"description": "以 KiCad 为主的电子硬件开发流程,覆盖电路实施、PCB 布局布线、验证和制造交付。",
"author": {
"name": "xufeng",
"url": "https://git.playones.com/xufeng"
},
"homepage": "https://git.playones.com/xufeng/hardware-development",
"repository": "https://git.playones.com/xufeng/hardware-development.git",
"license": "UNKNOWN",
"keywords": [
"hardware-development",
"kicad",
"pcb",
"schematic",
"manufacturing"
],
"interface": {
"displayName": "硬件开发",
"shortDescription": "以 KiCad 完成电路、PCB、验证和制造交付。",
"longDescription": "以 KiCad 为主要执行工具,支持 Cadence/OrCAD 既有电路输入,覆盖工程基准、器件依据、原理图转换、封装与网表核对、功能布局、布线验收、DRC 和 Gerber 制造交付。",
"developerName": "xufeng",
"category": "Developer Tools",
"capabilities": [
"Interactive",
"Read",
"Write"
],
"defaultPrompt": [
"使用硬件开发 Skill 确定当前工程和有效约束,推进本次硬件设计阶段。",
"使用硬件开发 Skill 审查这个 KiCad PCB 工程并给出可追溯的验证结果。"
],
"websiteURL": "https://git.playones.com/xufeng/hardware-development",
"privacyPolicyURL": "https://git.playones.com/xufeng/hardware-development",
"termsOfServiceURL": "https://git.playones.com/xufeng/hardware-development",
"brandColor": "#0F766E"
}
},
"skillDescriptions": {
"hardware-development": "用于以 KiCad 为主的电子硬件开发,包括 Cadence/OrCAD 原理图转换、封装与网表核对、PCB 功能布局、布线验收、DRC 和 Gerber 制造交付。适用于已有电路的实施与审查,不用于纯软件或说明性框图。"
}
},
{
"id": "next-skills",
"repo": "https://github.com/vercel/next.js.git",