xufeng
1ce0152197
Separate reusable current-path, Kelvin sensing, startup-state and routing checks from the BMS case parameters, and include a project review template. Constraint: Preserve project-specific limits and distinguish analysis from hardware tests. Confidence: High for package structure and reviewed decision boundaries. Scope-risk: Narrow; new standalone skill, no PCB changes. Tested: Skill validator, relative links, market source configuration, read-only scenario review. Not-tested: Remote authentication returned HTTP 401; no EDA or hardware execution.
5 lines
375 B
YAML
5 lines
375 B
YAML
interface:
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display_name: "大电流 PCB 硬件设计"
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short_description: "设计与审核大电流 PCB 的载流路径、开尔文采样、布线和温升验证"
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default_prompt: "使用 $high-current-pcb-design，按当前项目要求设计或审核大电流 PCB，核对载流路径、开尔文采样、启动状态与布线，并报告验证证据和剩余问题。"
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